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Zhihong Mai
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2020 – today
- 2021
- [c2]Zhihong Mai, Quanzhong Zhao, Zheng Liu, Weisheng Hou, Liang Zeng:
An intelligent Cable Detection System in Shallow Water Area. AIAM (ACM) 2021: 773-782
2010 – 2019
- 2018
- [j11]Pik Kee Tan, Yuzhe Zhao, Francis Rivai, Binghai Liu, Yanlin Pan, Ran He, Hao Tan, Zhihong Mai:
Cross-sectional nanoprobing sample preparation on sub-micron device with fast laser grooving technique. Microelectron. Reliab. 88-90: 309-314 (2018) - [j10]Shaalini Chithambaram, Pik Kee Tan, Yuzhe Zhao, Binghai Liu, Yinzhe Ma, Alfred Quah, Dayanand Nagalingam, Yanlin Pan, Zhihong Mai:
Failure analysis on 14 nm FinFET devices with ESD CDM failure. Microelectron. Reliab. 88-90: 321-333 (2018) - [c1]Long Ma, Zhihong Mai, He Chen, Wenchao Liu, Fan Feng, Guichi Liu, Nouman Qadeer Soomro:
Change Detection in Optical Remote Sensing Images with a Fully Object-Level Approach. IGARSS 2018: 1914-1917 - 2017
- [j9]Changqing Chen, Ghim Boon Ang, Jeffrey Lam, Zhihong Mai:
In-depth circuits edit analysis to reveal the implantation-related defect. Microelectron. J. 62: 38-42 (2017) - [j8]Alfred C. T. Quah, Dayanand Nagalingam, Seung Je Moon, Edy Susanto, Ghim Boon Ang, Soh Ping Neo, Jeffrey Lam, Zhihong Mai:
Static fault localization of subtle metallization defects using near infrared photon emission microscopy. Microelectron. Reliab. 73: 76-91 (2017) - [j7]Changqing Chen, Ghim Boon Ang, Peng Tiong Ng, Francis Rivai, Soh Ping Neo, Dayanand Nagalingam, Kim Hong Yip, Jeffery Lam, Zhihong Mai:
Application of Scanning Capacitance Microscopy on SOI device with wafer edge low yield pattern. Microelectron. Reliab. 76-77: 141-144 (2017) - [j6]Soh Ping Neo, Alfred C. T. Quah, Ghim Boon Ang, Dayanand Nagalingam, Hnin Hnin Ma, Siong Luong Ting, C. W. Soo, Changqing Chen, Zhihong Mai, Jeffrey Lam:
Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect. Microelectron. Reliab. 76-77: 255-260 (2017) - [j5]Changqing Chen, Ghim Boon Ang, Peng Tiong Ng, Francis Rivai, Hui Peng Ng, Alfred C. T. Quah, Angela Teo, Jeffery Lam, Zhihong Mai:
Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis. Microelectron. Reliab. 76-77: 261-266 (2017) - 2016
- [j4]Changqing Chen, P. T. Ng, Ghinboon Ang, H. Tan, Francis Rivai, Y. Z. Ma, Huipeng Ng, Jeffrey Lam, Zhihong Mai:
Electrical analysis on implantation-related defect by nanoprobing methodology. Microelectron. Reliab. 64: 317-320 (2016) - [j3]Huei Hao Yap, Pik Kee Tan, Lei Zhu, H. Feng, Yuzhe Zhao, Ran He, Hao Tan, B. Liu, Y. M. Huang, D. D. Wang, Jeffrey Lam, Zhihong Mai:
Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue. Microelectron. Reliab. 64: 357-361 (2016) - [j2]Yuzhe Zhao
, Q. J. Wang, Pik Kee Tan, Huei Hao Yap, Binghai Liu, H. Feng, Hao Tan, Ran He, Y. M. Huang, D. D. Wang, Lei Zhu, C. Q. Chen, Francis Rivai, Jeffrey Lam, Zhihong Mai:
Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system. Microelectron. Reliab. 64: 362-366 (2016) - 2015
- [j1]Huei Hao Yap
, Pik Kee Tan, G. R. Low, M. K. Dawood, Hua Feng, Yuzhe Zhao, Ran He, Hao Tan, J. Zhu, Binghai Liu, Y. M. Huang, D. D. Wang, Jeffrey Lam, Zhihong Mai:
Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique. Microelectron. Reliab. 55(9-10): 1611-1616 (2015)
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last updated on 2024-06-11 20:38 CEST by the dblp team
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