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ORCIDLutz Meinshausen
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2020 – today
- 2020
[c2]Betting Wehring, Raik Hoffmann, Lukas Gerlich, Malte Czernohorsky, Benjamin Uhlig, Robert Seidel, Tobias Barchewitz, Frank Schlaphof, Lutz Meinshausen, Christoph Leyens:
BEoL Reliability, XPS and REELS Study on low-k Dielectrics to understand Breakdown Mechanisms. IRPS 2020: 1-5
2010 – 2019
- 2018
- [c1]Jinglin Shi, A. Sidelnicov, Kok Wai J. Chew, Mei See Chin, C. Schippel, J. M. M. dos Santos, Frank Schlaphof, Lutz Meinshausen, John R. Long, David L. Harame:
Evolution and Optimization of BEOL MOM Capacitors Across Advanced CMOS Nodes. ESSDERC 2018: 190-193 - 2015
- [j8]Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano:
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. Microelectron. Reliab. 55(1): 192-200 (2015) - [j7]Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont:
Dynamical IMC-growth calculation. Microelectron. Reliab. 55(9-10): 1832-1837 (2015) - 2013
- [j6]Aymen Moujbani, Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Lutz Meinshausen:
Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. Microelectron. Reliab. 53(9-11): 1365-1369 (2013) - [j5]Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano:
Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads. Microelectron. Reliab. 53(9-11): 1575-1580 (2013) - 2012
- [j4]Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage:
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers. Microelectron. Reliab. 52(9-10): 1827-1832 (2012) - [j3]Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont:
Electro- and thermo-migration induced failure mechanisms in Package on Package. Microelectron. Reliab. 52(12): 2889-2906 (2012) - 2011
- [j2]Irina Bauer, Kirsten Weide-Zaage, Lutz Meinshausen:
Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization. Microelectron. Reliab. 51(9-11): 1587-1591 (2011) - [j1]Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont:
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps. Microelectron. Reliab. 51(9-11): 1860-1864 (2011)
Coauthor Index
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