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ORCIDArtur Wymyslowski
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2010 – 2019
- 2017
[j22]Artur Wymyslowski:
Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 74: 118-120 (2017)- 2016
- [j21]Artur Wymyslowski:
Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 62: 1-3 (2016) - 2015
- [j20]Artur Wymyslowski:
Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 55(5): 713-715 (2015) - [j19]Dawid Jan Król, Artur Wymyslowski, Kamil Nouri Allaf:
Adhesion work analysis through molecular modeling and wetting angle measurement. Microelectron. Reliab. 55(5): 758-764 (2015) - 2014
- [j18]Artur Wymyslowski:
Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 54(6-7): 1179-1181 (2014) - [c1]Ryszard Swierczynski, Krzysztof Urbanski, Artur Wymyslowski:
Improving co-design of smart sensor front-ends. MIXDES 2014: 236-240 - 2013
- [j17]Artur Wymyslowski, Lukasz Dowhan:
Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials. Microelectron. Reliab. 53(3): 443-451 (2013) - [j16]Didier Chicot
, K. Tilkin, K. Jankowski, Artur Wymyslowski:
Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique. Microelectron. Reliab. 53(5): 761-766 (2013) - [j15]Artur Wymyslowski:
Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 53(8): 1043-1044 (2013) - 2012
- [j14]Artur Wymyslowski:
2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 52(7): 1253-1254 (2012) - [j13]E. R. Weltevreden, S. J. Tesarski, Artur Wymyslowski, Müge Erinc, Alexander W. J. Gielen:
A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging. Microelectron. Reliab. 52(7): 1300-1305 (2012) - 2011
- [j12]Artur Wymyslowski:
2010 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 51(6): 1025-1026 (2011) - [j11]Lukasz Dowhan, Artur Wymyslowski, Pawel Janus, Magdalena Ekwinska, Olaf Wittler:
Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods. Microelectron. Reliab. 51(6): 1046-1053 (2011) - [j10]Lukasz Dowhan, Artur Wymyslowski, Stanislaw Kalicinski, Pawel Janus:
Numerical prototyping methods in microsystem accelerometers design. Microelectron. Reliab. 51(7): 1276-1282 (2011) - 2010
- [j9]Artur Wymyslowski:
Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 50(7): 891-892 (2010)
2000 – 2009
- 2009
- [j8]Artur Wymyslowski:
Guest Editorial: 2008 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 49(8): 823-824 (2009) - 2008
- [j7]Artur Wymyslowski:
Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 48(6): 803-804 (2008) - [j6]Lukasz Dowhan, Artur Wymyslowski, Rainer Dudek:
An approach of numerical multi-objective optimization in stacked packaging. Microelectron. Reliab. 48(6): 851-857 (2008) - 2007
- [j5]Artur Wymyslowski, Bart Vandevelde, Dag Andersson:
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 47(2-3): 159-160 (2007) - [j4]Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang:
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. Microelectron. Reliab. 47(2-3): 280-289 (2007) - [j3]Tomasz Falat, Artur Wymyslowski, Jana Kolbe:
Numerical approach to characterization of thermally conductive adhesives. Microelectron. Reliab. 47(2-3): 342-346 (2007) - [j2]Artur Wymyslowski:
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 47(12): 1967-1968 (2007) - [j1]Tomasz Falat, Artur Wymyslowski, Jana Kolbe, Kaspar M. B. Jansen, Leo J. Ernst:
Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach. Microelectron. Reliab. 47(12): 1989-1996 (2007)
Coauthor Index
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